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available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 m odel xc0900a - 05 rev c 5 db directional coupler description the xc0900a - 05 is a low profile, high performance 5db directional coupler in a new easy to use, manufacturing friendly surface mount package. it is designed for amps band applications . the xc0900a - 05 is designed particularly for non - binary split and combine in high power amplifiers, e.g. used along with a 3db to get a 3 - way, plus other signal distribution applications where low insertion loss is required. it can be used in high power a pplications up to 250 watts. parts have been subjected to rigorous qualification testing and they are manufactured using materials with coefficients of thermal expansion (cte) compatible with common substrates such as fr4, g - 10, rf - 35, ro4350, and polyimi de. electrical specifications ** frequency mean couplin g insertion loss vswr phase balance mhz db db max max : 1 degrees 800 - 1000 5.0 0.35 0.19 1.19 90 2.0 869 - 894 5.0 0.25 0.15 1.12 90 2.0 925 - 960 5.0 0.25 0.15 1.12 90 2.0 directivity frequency sensitivity power q jc operating temp. db min db max avg. cw watts o c/watt o c 21 0.25 200 12.5 - 55 to +95 23 0.05 250 12.5 - 55 to +95 features: 800 ? 1000 mhz amps high power very low loss tight coupling high directivity production friendly tape and reel available in lead - free (as illustrated) or tin - lead reliable, fit=0.53 23 0.05 250 12.5 - 55 to +95 **specification based on performance of unit properly installed on anaren test board 58481 - 0001 with small signal appli ed. specifications subject to change without notice. refer to parameter definitions for details. xc0900a-05* mechanical outline dimensions are in inches [millimeters] side view .064 .006 [1.62 0.15 ] bottom view (far-side) top view (near-side) denotes array number 4x .040 .004 [1.02 0.10 ] 4x .059 .004 sq [1.50 0.10 ] .430 .004 [10.92 0.10 ] .220 .004 [5.59 0.10 ] gnd gnd pin 1 pin 2 pin 3 pin 4 pin 1 pin 2 pin 4 pin 3 .560 .010 [14.22 0.25 ] .350 .010 [8.89 0.25 ] orientation marker denotes pin 1 * = plating finish tolerances are non-cumulative
usa/canada: to ll free: europe: (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 available on tape and reel for pick and place manufacturing. model xc0900a - 05 rev c directional coupler pin configuration the xc0900a - 05 has an orientation marker to denote pin 1. once port one has been id entified the other ports are known automatically. please see the chart below for clarification: pin 1 pin 2 pin 3 pin 4 input isolated direct coupled isolated input coupled direct direct coupled input isolated coupled dir ect isolated input note: the direct port has a dc connection to the input port and the coupled port has a dc connection to the isolated port.
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 m odel xc0900a - 05 rev c insertion loss and power derating curves insertion loss derating: the insertion loss, at a given frequency, of a group of couplers is measured at 25 c and then averaged. the measurements are performed under small signal conditions (i.e. using a vector network analyzer). the process is repeated at 95 c, 150 c, and 200 c. a best - fit line for the meas ured data is computed and then plotted from - 55 c to 300 c. power derating: the power handling and corresponding power derating plots are a function of the thermal resistance, mounting surface temperature (base plate temperature), maximum continuous opera ting temperature of the coupler, and the thermal insertion loss. the thermal insertion loss is defined in the power handling section of the data sheet. as the mounting interface temperature approaches the maximum continuous operating temperature, the p ower handling decreases to zero. -100 -50 0 50 100 150 200 250 300 350 -0.2 -0.18 -0.16 -0.14 -0.12 -0.1 -0.08 -0.06 -0.04 -0.02 0 temperature of the part (oc) insertion loss (db) typical insertion loss derating curve for xc0900a-05 typical insertion loss (f=894mhz) typical insertion loss (f=960mhz) typical insertion loss (f=1000mhz) 0 25 50 75 100 125 150 175 200 225 250 275 300 0 25 50 75 100 125 150 175 200 225 250 275 300 325 350 base plate temperature (oc) power (watts) power derating curve for xc0900a-05 power handling at 894mhz power handling at 960mhz power handling at 1000mhz
usa/canada: to ll free: europe: (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 available on tape and reel for pick and place manufacturing. model xc0900a - 05 rev c typical performance ( - 55c, 25c and 95c): 800 - 1000 mhz 800 820 840 860 880 900 920 940 960 980 1000 -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 frequency (mhz) return loss (db) return loss for xc0900a-05 (feeding port 1) - 55oc 25oc 95oc 800 820 840 860 880 900 920 940 960 980 1000 -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 frequency (mhz) return loss (db) return loss for xc0900a-05 (feeding port 2) - 55oc 25oc 95oc 800 820 840 860 880 900 920 940 960 980 1000 -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 frequency (mhz) return loss (db) return loss for xc0900a-05 (feeding port 3) - 55oc 25oc 95oc 800 820 840 860 880 900 920 940 960 980 1000 -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 frequency (mhz) return loss (db) return loss for xc0900a-05 (feeding port 4) - 55oc 25oc 95oc
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 m odel xc0900a - 05 rev c typical performance ( - 55c, 25c and 95c): 800 - 1000 mhz 800 820 840 860 880 900 920 940 960 980 1000 -5.5 -5.4 -5.3 -5.2 -5.1 -5 -4.9 -4.8 -4.7 -4.6 -4.5 frequency (mhz) coupling (db) coupling for xc0900a-05 (feeding port 1) - 55oc 25oc 95oc 800 820 840 860 880 900 920 940 960 980 1000 -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 frequency (mhz) directivity (db) directivity for xc0900a-05 (feeding port 1) - 55oc 25oc 95oc 800 820 840 860 880 900 920 940 960 980 1000 87 88 89 90 91 92 93 frequency (mhz) phase balance (degrees) phase balance for xc0900a-05 (feeding port 1) - 55oc 25oc 95oc 800 820 840 860 880 900 920 940 960 980 1000 -2 -1.95 -1.9 -1.85 -1.8 -1.75 -1.7 -1.65 -1.6 -1.55 -1.5 frequency (mhz) transmission loss (db) transmission loss for xc0900a-05 (feeding port 1) - 55oc 25oc 95oc
usa/canada: to ll free: europe: (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 available on tape and reel for pick and place manufacturing. model xc0900a - 05 rev c typical performance ( - 55c, 25c and 95c): 800 - 1000 mhz 800 820 840 860 880 900 920 940 960 980 1000 -0.16 -0.14 -0.12 -0.1 -0.08 -0.06 -0.04 -0.02 0 frequency (mhz) insertion loss (db) insertion loss for xc0900a-05 (feeding port 1) - 55oc 25oc 95oc
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 m odel xc0900a - 05 rev c definition of measured specifications parameter definition mathematical representation vswr (voltage standing wave ratio) the impedance match of the coupler to a 50 w system. a vswr of 1:1 is optimal. vswr = min max v v vmax = voltage maxima of a standing wave vmin = voltage mi nima of a standing wave return loss the impedance match of the coupler to a 50 w system. return loss is an alternate means to express vswr. return loss (db)= 20log 1 - vswr 1 vswr + mean coupling at a given frequency ( w n ), coupling is the input p ower divided by the power at the coupled port. mean coupling is the average value of the coupling values in the band. n is the number of frequencies in the band. coupling (db) = ? ? ? ? ? = ) ( p ) ( p log 10 ) ( cpl in n n n c w w w mean coupling (db) = n c n n n ? = 1 ) ( w ins ertion loss the input power divided by the sum of the power at the two output ports. 10log direct cpl in p p p + directivity the power at the coupled port divided by the power at the isolated port. 10log iso cpl p p phase balance the diff erence in phase angle between the two output ports. phase at coupled port ? phase at direct port frequency sensitivity the decibel difference between the maximum in band coupling value and the mean coupling, and the decibel difference between the minimum in band coupling value and the mean coupling. max coupling (db) ? mean coupling (db) and min coupling (db) ? mean coupling (db)
usa/canada: to ll free: europe: (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 available on tape and reel for pick and place manufacturing. model xc0900a - 05 rev c notes on rf testing and circuit layout the xc0900a - 05 surface mount co uplers require the use of a test fixture for verification of rf performance. this test fixture is designed to evaluate the coupler in the same environment that is recommended for installation. enclosed inside the test fixture, is a circuit board that is fa bricated using the recommended footprint. the part being tested is placed into the test fixture and pressure is applied to the top of the device using a pneumatic piston. a four port vector network analyzer is connected to the fixture and is used to measur e the s - parameters of the part. worst case values for each parameter are found and compared to the specification. these worst case values are reported to the test equipment operator along with a pass or fail flag. see the illustrations below. 3 & 5 db test board 10 & 20 db test board test board in fixture test station
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 m odel xc0900a - 05 rev c the effects of the test fixture on the measured data must be minimized in order to accurately determine the performance of the device under test. if the line impedance is anything other than 50 w and/or there is a discontinuity at the microstrip t o sma interface, there will be errors in the data for the device under test. the test environment can never be ?perfect?, but the procedure used to build and evaluate the test boards (outlined below) demonstrates an attempt to minimize the errors associate d with testing these devices. the lower the signal level that is being measured, the more impact the fixture errors will have on the data. parameters such as return loss and isolation/directivity, which are specified as low as 27db and typically measure at much lower levels, will present the greatest measurement challenge. the test fixture errors introduce an uncertainty to the measured data. fixture errors can make the performance of the device under test look better or worse than it actually is. for exam ple, if a device has a known return loss of 30db and a discontinuity with a magnitude of ? 35db is introduced into the measurement path, the new measured return loss data could read anywhere between ? 26db and ? 37db. this same discontinuity could introduce a n insertion phase error of up to 1 . there are different techniques used throughout the industry to minimize the affects of the test fixture on the measurement data. anaren uses the following design and de - embedding criteria: test boards have been design ed and parameters specified to provide trace impedances of 50 1 w . furthermore, discontinuities at the sma to microstrip interface are required to be less than ? 35db and insertion phase errors (due to differences in the connector interface discontinuities and the electrical line length) should be less than 0.25 from the median value of the four paths. a ?thru? circuit board is built. this is a two port, microstrip board that uses the same sma to microstrip interface and has the same total length (inserti on phase) as the actual test board. the ?thru? board must meet the same stringent requirements as the test board. the insertion loss and insertion phase of the ?thru? board are measured and stored. this data is used to completely de - embed the device under test from the test fixture. the de - embedded data is available in s - parameter form on the anaren website (www.anaren.com). note : the s - parameter files that are available on the anaren.com website include data for frequencies that are outside of the speci fied band. it is important to note that the test fixture is designed for optimum performance through 2.3ghz. some degradation in the test fixture performance will occur above this frequency and connector interface discontinuities of ? 25db or more can be ex pected. this larger discontinuity will affect the data at frequencies above 2.3ghz. circuit board layout the dimensions for the anaren test board are shown below. the test board is printed on rogers ro4350 material that is 0.030? thick. consider the case when a different material is used. first, the pad size must remain the same to accommodate the part. but, if the material thickness or dielectric constant (or both) changes, the reactance at the interface to the coupler will also change. second, the linew idth required for 50 w will be different and this will introduce a step in the line at the pad where the coupler interfaces with the printed microstrip trace. both of these conditions will affect the performance of the part. to achieve the specified perform ance, serious attention must be given to the design and layout of the circuit environment in which this component will be used. if a different circuit board material is used, an attempt should be made to achieve the same interface pad reactance that is pr esent on the anaren ro4350 test board. when thinner circuit board material is used, the ground plane will be closer to the pad yielding more capacitance for the same size interface pad. the same is true if the dielectric constant of the circuit board mater ial is higher than is used on the anaren test board. in both of these cases, narrowing the line before the interface pad will introduce a series inductance, which, when properly tuned, will compensate for the extra capacitive reactance. if a thicker circui t board or one with a lower dielectric constant is used,
usa/canada: to ll free: europe: (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 available on tape and reel for pick and place manufacturing. model xc0900a - 05 rev c the interface pad will have less capacitive reactance than the anaren test board. in this case, a wider section of line before the interface pad (or a larger interface pad) will introduce a shunt cap acitance and when properly tuned will match the performance of the anaren test board. notice that the board layout for the 3db and 5db couplers is different from that of the 10db and 20db couplers. the test board for the 3db and 5db couplers has all four traces interfacing with the coupler at the same angle. the test board for the 10db and 20db couplers has two traces approaching at one angle and the other two traces at a different angle. the entry angle of the traces has a significant impact on the rf pe rformance and these parts have been optimized for the layout used on the test boards shown below. 10 & 20db test board 3 & 5db test board testing sample parts supplied on anaren test boards if you have received a co upler installed on an anaren produced microstrip test board, please remember to remove the loss of the test board from the measured data. the loss is small enough that it is not of concern for return loss and isolation/directivity, but it should certainly be considered when measuring coupling and calculating the insertion loss of the coupler. an s - parameter file for a ?thru? board (see description of ?thru? board above) will be supplied upon request. as a first order approximation, one should consider the f ollowing loss estimates: frequency band avg. ins. loss of test board @ 25 c 800 ? 1000 mhz ~ 0.07db 1700 ? 2300 mhz ~ 0.12db for example, a 1900mhz, 10db coupler on a test board may measure ? 10.30db from input to the coupled port at some frequency, f1 . when the loss of the test board is removed, the coupling at f1 becomes - 10.18db ( - 10.30db + 0.12db). this compensation must be made to both the coupled and direct path measurements when calculating insertion loss. the loss estimates in the table above c ome from room temperature measurements. it is important to note that the loss of the test board will change with temperature. this fact must be considered if the coupler is to be evaluated at other temperatures.
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 m odel xc0900a - 05 rev c peak power handling high - pot testing of t hese couplers during the qualification procedure resulted in a minimum breakdown voltage of 1.7kv (minimum recorded value). this voltage level corresponds to a breakdown resistance capable of handling at least 12db peaks over average power levels, for very short durations. the breakdown location consistently occurred across the air interface at the coupler contact pads (see illustration below). the breakdown levels at these points will be affected by any contamination in the gap area around these pads. thes e areas must be kept clean for optimum performance. it is recommended that the user test for voltage breakdown under the maximum operating conditions and over worst case modulation induced power peaking. this evaluation should also include extreme environm ental conditions (such as high humidity). orientation marker a printed circular feature appears on the top surface of the coupler to designate pin 1. this orientation marker is not intended to limit the use of the symmetry that these couplers exhib it but rather to facilitate consistent placement of these parts into the tape and reel package. this ensures that the components are always delivered with the same orientation. refer to the table on page 2 of the data sheet for allowable pin configurations . test plan xinger ii couplers are manufactured in large panels and then separated. a sample population of parts is rf small signal tested at room temperature in the fixture described above. all parts are dc tested for shorts/opens. (see ?qualification f low chart? section for details on the accelerated life test procedures.)
usa/canada: to ll free: europe: (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 available on tape and reel for pick and place manufacturing. model xc0900a - 05 rev c power handling the average power handling (total input power) of a xinger coupler is a function of: internal circuit temperature. unit mounting interface temperature. u nit thermal resistance power dissipated within the unit. all thermal calculations are based on the following assumptions: the unit has reached a steady state operating condition. maximum mounting interface temperature is 95 o c. conduction heat transfer through the mounting interface. no convection heat transfer. no radiation heat transfer. the material properties are constant over the operating temperature range. finite element simulations are made for each unit. the simulation results are used to cal culate the unit thermal resistance. the finite element simulation requires the following inputs: unit material stack - up. material properties. circuit geometry. mounting interface temperature. thermal load (dissipated power). the classical definition for dissipated power is temperature delta ( d t) divided by thermal resistance (r). the dissipated power (p dis ) can also be calculated as a function of the total input power (p in ) and the thermal insertion loss (il therm ): ) ( 10 1 10 w p r t p therm il in dis ? ? ? ? ? - = d = - (1) power flow and nomenclature for an ?x? style coupler is shown in figure 1.
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 m odel xc0900a - 05 rev c pin 1 pin 4 input port coupled port direct port isolated port p in p out (rl) p out (iso) p out (cpl) p out (dc) figure 1 the coupler is excited at the input port with p in (watts) of power. assuming the coupler is not ideal, and that there are no radiation l osses, power will exit the coupler at all four ports. symbolically written, p out(rl) is the power that is returned to the source because of impedance mismatch, p out(iso) is the power at the isolated port, p out(cpl) is the power at the coupled port, and p out(dc) is the power at the direct port. at anaren, insertion loss is defined as the log of the input power divided by the sum of the power at the coupled and direct ports: note: in this document, insertion loss is taken to be a positive number. in ma ny places, insertion loss is written as a negative number. obviously, a mere sign change equates the two quantities. ) db ( p p p log 10 il ) dc ( out ) cpl ( out in 10 ? ? ? ? ? + = (2) in terms of s - parameters, il can be computed as follows: ) db ( s s log 10 il 2 41 2 31 10 ? ? ? ? + - = (3) we notice that this insertion loss value includes the power lost because of return loss as well as power lost to the isolated port. for thermal calculations, we are only interested in the power lost ?inside? the coupler. sin ce p out(rl) is lost in the source termination and p out(iso) is lost in an external termination, they are not be included in the insertion loss for thermal calculations. therefore, we define a new insertion loss value solely to be used for thermal calculat ions:
usa/canada: to ll free: europe: (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 available on tape and reel for pick and place manufacturing. model xc0900a - 05 rev c ) ( log 10 ) ( ) ( ) ( ) ( 10 db p p p p p il rl out iso out dc out cpl out in therm ? ? ? ? ? + + + = (4) in terms of s - parameters, il therm can be computed as follows: ) ( log 10 2 41 2 31 2 21 2 11 10 db s s s s il therm ? ? ? ? + + + - = (5) the thermal resistance and power dissipated within the unit are then used to calculate the average total input powe r of the unit. the average total steady state input power (p in ) therefore is: ) ( 10 1 10 1 10 10 w r t p p therm therm il il dis in ? ? ? ? ? - d = ? ? ? ? ? - = - - (6) where the temperature delta is the circuit temperature (t circ ) minus the mounting interface temperature (t mnt ): ) ( c t t t o mnt circ - = d (7) the maximum allowable circuit temperature is defined by the properties of the materials used to construct the unit. multiple material combinations and bonding techniques are used within the xinger ii product family to optimize rf performance . consequently the maximum allowable circuit temperature varies. please note that the circuit temperature is not a function of the xinger case (top surface) temperature. therefore, the case temperature cannot be used as a boundary condition for power ha ndling calculations. due to the numerous board materials and mounting configurations used in specific customer configurations, it is the end users responsibility to ensure that the xinger ii coupler mounting interface temperature is maintained within th e limits defined on the power derating plots for the required average power handling. additionally appropriate solder composition is required to prevent reflow or fatigue failure at the rf ports. finally, reliability is improved when the mounting interfa ce and rf port temperatures are kept to a minimum. the power - derating curve illustrates how changes in the mounting interface temperature result in converse changes of the power handling of the coupler.
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 m odel xc0900a - 05 rev c mounting in order for xinger surface mount couple rs to work optimally, there must be 50 ? transmission lines leading to and from all of the rf ports. also, there must be a very good ground plane underneath the part to ensure proper electrical performance. if either of these two conditions is not satisfied, electrical performance may not meet published specifications. overall ground is improved if a dense population of plated through holes connect the top and bottom ground layers of the pcb. this minimizes ground inductance and improves ground continuity. all of the xinger hybrid and directional couplers are constructed from ceramic filled ptfe composites which possess excellent electrical and mechanical stability having x and y thermal coefficient of expansion (cte) of 17 - 25 ppm/ o c. when a surface mount h ybrid coupler is mounted to a printed circuit board, the primary concerns are; ensuring the rf pads of the device are in contact with the circuit trace of the pcb and insuring the ground plane of neither the component nor the pcb is in contact with the rf signal. mounting footprint to ensure proper electrical and thermal performance there must be a ground plane with 100 % solder connection underneath the part dimensions are in inches [millimeters] xc0900a-05* mounting footprint 4x .066 sq [1.68] 4x 50 v transmission line multiple plated thru holes to ground .430 [10.92] 4x .040 [1.02] .220 [5.59] * = plating finish coupler mounting process the process for assembling this component is a conventional surface mount process as shown in figure 1. this process is conducive to both low and high volume usage. figure 1: surface mounting process steps storage of components: the xinger ii products are available in either an immersion tin or tin - lead finish. commonly used storage procedures used to control oxidation should be followed f or these surface mount components. the storage temperatures should be held between 15 o c and 60 o c. substrate: depending upon the particular component, the circuit material has an x and y coefficient of thermal expansion of between 17 and 25 ppm/c. this c oefficient minimizes solder joint stresses due to similar expansion rates of most commonly used board substrates such as rf35, ro4350, fr4, polyimide and g - 10 materials. mounting to ?hard? substrates (alumina etc.) is possible depending upon operational te mperature requirements. the solder surfaces of the coupler are all copper plated with either an immersion tin or tin - lead exterior finish. solder paste: all conventional solder paste formulations will work well with anaren?s xinger ii surface mount compon ents. solder paste can be applied with stencils or syringe dispensers. an example of a stenciled solder paste deposit is shown in figure 2. as shown in the figure solder paste is applied to the four rf pads and the entire ground plane underneath the body of the part.
usa/canada: to ll free: europe: (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 available on tape and reel for pick and place manufacturing. model xc0900a - 05 rev c figure 2: solder paste application coupler positioning: the surface mount coupler can be placed manually or with automatic pick and place mechanisms. couplers should be placed (see figure 3 and 4) onto wet paste with common surface mou nt techniques and parameters. pick and place systems must supply adequate vacuum to hold a 0.50 - 0.55 gram coupler. figure 3: component placement figure 4: mounting features example reflow: the surface mount coupler is conducive to most of toda y?s conventional reflow methods. a low and high temperature thermal reflow profile are shown in figures 5 and 6, respectively. manual soldering of these components can be done with conventional surface mount non - contact hot air soldering tools. board pre - h eating is highly recommended for these selective hot air soldering methods. manual soldering with conventional irons should be avoided.
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 m odel xc0900a - 05 rev c figure 5 ? low temperature solder reflow thermal profile figure 6 ? high temperature solder reflow ther mal profile
usa/canada: to ll free: europe: (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 available on tape and reel for pick and place manufacturing. model xc0900a - 05 rev c qualification flow chart
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 m odel xc0900a - 05 rev c
usa/canada: to ll free: europe: (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 available on tape and reel for pick and place manufacturing. model xc0900a - 05 rev c material declaration xc0900a - 05s immersion tin finish material weight (lbs) (g) (ppm) cas number 2 - thiourea 3.1136e - 07 1.4123e - 04 2.7185e+02 62 - 56 - 6 acetone 67 - 64 - 1 a luminum 7429 - 90 - 5 arsenic 3.4444e - 07 1.5624e - 04 3.0074e+02 7440 - 38 - 2 brominated epoxy resin 68928 - 70 - 1 bt resin ------------- chromium 6.8888e - 08 3.1248e - 05 6.0148e+01 7440 - 47 - 3 copper 3.7539e - 04 1.7028e - 01 3.2777e+05 744 0 - 50 - 8 edta disodium salt 3.1136e - 08 1.4123e - 05 2.7185e+01 139 - 33 - 3 fiberglass 4.4280e - 05 2.0086e - 02 3.8662e+04 65997 - 17 - 3 fused silica 4.8180e - 04 2.1855e - 01 4.2067e+05 60676 - 86 - 0 lead 7439 - 92 - 1 polyimide 60842 - 76 - 4 polyphenylen e ether resin ------------- ptfe 1.7391e - 04 7.8887e - 02 1.5185e+05 9002 - 84 - 0 proprietary / unknown 9.3407e - 08 4.2369e - 05 8.1555e+01 ------------- sodium hypophosphite 9.3407e - 08 4.2369e - 05 8.1555e+01 7681 - 53 - 0 stannous chloride 3.7363e - 08 1.6948e - 05 3.2622e+01 ------------- steel 7439 - 89 - 6 25067 - 11 - 2 tetrafluoroethylene hexaflouoropropylene copolymer tin 5.6044e - 08 2.5422e - 05 4.8933e+01 7440 - 31 - 5 titanium dioxide 6.8888e - 05 3.1248e - 02 6.0148e+04 1 3463 - 67 - 7 xylene 1330 - 20 - 7 total weight calculated 1.1453e - 03 5.1951e - 01 total weight measured 1.1500e - 03 5.2164e - 01 the values presented above are estimates at the current revision, and it is derived from vendor supplied data. while anaren strives for accurate reporting, due to product and process variations at both anaren and our suppliers, the quoted values are our best estimates only, and not measured absolute values. product specifications are subject to change without notice.
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 m odel xc0900a - 05 rev c application information the xc0900a - 05 is an ?x? style 5db coupler. port configurations are defined in the table on page 2 of this data sheet and an example driving port 1 is shown below. note that this is not an ?h? style coupler like the older 5db xinger couplers (such as the 1d1304 - 5 and 1a1305 - 5). the change was made to allow better placement of the termination resistors when the coupler is used in a serial splitter/combiner network. ideal coupler operatio n 1 2 1v 0.562v e q ( - 5db) 0.827v e q - 90 ( - 1.65db) isolated port 4 3 the primary application for 5db couplers is in serial splitting and combining networks. these networks are often employed when the combining of 3 amplifiers is required. unlike corporate networks, serial networks are not limited to binary divisions ( corporate networks are limited to 2 n number of splits, where n is an integer). serial networks can be designed with [3, 4, 5, ?.., n] splits, but have a practical limitation of about 8 splits. a 5db coupler is used in conjunction wit h a 3db coupler to build 3 - way splitter/combiner networks. an ideal version of this network is illustrated below. note what is required; a 50% split (i.e. 3db coupler) and a 66% and 33% split (which is actually a 4.77db coupler, but due to losses in the sy stem higher coupler values, such as 5db, are actually better suited for this function). the design of this type of circuit requires special attention to the losses and phase lengths of the components and the interconnecting lines. a more in depth look at s erial networks can be found in the article ?designing in - line divider/combiner networks? by samir tozin, which describes the circuit design in detail and can be found in the white papers section of the anaren website, www.anaren.com. 3 - way ideal serial sp litter/combiner network 1/3 pin 2/3 pin 1/3 pin 1/3 p in g=1 g=1 g=1 pout 2/3 pin pin 1/3 pin 1/3 pin 1/3 pin 5 db (4.77) coupler 3 db coupler 3 db coupler 5 db (4.77) coupler * 50 w termination * 50 w termination * 50 w termination * 50 w termination *recommended terminations power (watts) model 8 rfp - 060120a15z50 15 rfp - 250375a4z50 50 rfp - 375375a6z50 100 rfp - 500500a6z50
usa/canada: to ll free: europe: (315) 432 - 8909 (800) 411 - 6596 +44 2392 - 232392 available on tape and reel for pick and place manufacturing. model xc0900a - 05 rev c packaging and ordering information parts are available in both reel and tube. packaging follows ei a 481 - 2. parts are oriented in tape and reel as shown below. minimum order quantities are 2000 per reel and 30 per tube. see model numbers below for further ordering information. b ? a ? c reel dimensions (inches [mm]) ?a b ?c 0.630 [16.0] 4.017 [102.03] 13.0 [330.0] 2000 quantity/reel table 1 ? d 0.512 [13.0] ?d xinger coupler frequency size coupling value plating finish packaging xc 0450= 410 - 480mhz 0900= 800 - 1000mhz 1900=1700 - 2000mhz 2100=2000 - 2300mhz a=0.56?x0.35? b=1.0?x0.5? e=0.56?x0.2? l=0.65?x0.48? t=0.65?x0.48? 03=3db 05=5db 10=10db 20=20db p=tin lead s=immersion tin t =tube r = tape & reel xx xxxx x - xx x x

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